0hmX/mt41k512m8da-107-it-p-footprints
This code defines the mechanical and physical layout of a Micron digital ball grid array (FBGA) package with 78 balls, including pin positions, footprint geometry, PCB pads, and silkscreen outlines for surface-mount integration.
- Version
- 0.1.1
- License
- unset
- Stars
- 1
evidence/checks.txt
tscircuit 0.0.2462
Netlist: exit 0, errors 0, warnings 0
placement summary: no placement issues
board top-layer utilization:
- occupied: 41.396% (105.56mm^2 of 255mm^2)
- empty spaces over 5% of board area:
- 19.667% (50.15mm^2); bounds=(minX=-7.5mm, maxX=-4.55mm, minY=-8.5mm, maxY=8.5mm)
- 19.667% (50.15mm^2); bounds=(minX=4.55mm, maxX=7.5mm, minY=-8.5mm, maxY=8.5mm)
board-edge status:
- U1: 3.49mm inside top edge
placement drc:
Errors: 0
Warnings: 0
No shorts detected in circuit.json
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