0hmX/mt41k512m8da-107-it-p-footprints

This code defines the mechanical and physical layout of a Micron digital ball grid array (FBGA) package with 78 balls, including pin positions, footprint geometry, PCB pads, and silkscreen outlines for surface-mount integration.

Version
0.1.1
License
unset
Stars
1

evidence/micron-mechanical.json

{
  "package": "DA",
  "bodyWidth": 8,
  "bodyHeight": 10.5,
  "bodyTolerance": 0.1,
  "pitch": 0.8,
  "xSpan": 6.4,
  "ySpan": 9.6,
  "rows": [
    "A",
    "B",
    "C",
    "D",
    "E",
    "F",
    "G",
    "H",
    "J",
    "K",
    "L",
    "M",
    "N"
  ],
  "columns": [
    1,
    2,
    3,
    7,
    8,
    9
  ],
  "ballCount": 78,
  "postReflowBallDiameter": 0.47,
  "packageSmdBallPadDiameter": 0.42,
  "sourcePage": 25,
  "sourceFigure": 10
}