0hmX/mt41k512m8da-107-it-p-footprints

This code defines the mechanical and physical layout of a Micron digital ball grid array (FBGA) package with 78 balls, including pin positions, footprint geometry, PCB pads, and silkscreen outlines for surface-mount integration.

Version
0.1.1
License
unset
Stars
1

evidence/verification.json

{
  "result": "PASS",
  "compiledPads": 78,
  "uniqueBallNames": 78,
  "micronGrid": "78/78 match",
  "kicadCentersAndDiameters": "78/78 match (Y axis normalized)",
  "originalImportMaxAxisDeltaMm": 0.00010799999999999699,
  "originalPadDiameterMm": 0.3839972,
  "newPadDiameterMm": 0.42,
  "minCopperGapMm": 0.3799999999999999,
  "scope": "Geometry and physical ball identity only; no electrical, assembly-process, or DDR routing validation."
}